Takafumi Fukushima received the B.S., M.S., Ph.D. degrees in Department of Materials Science and Chemical Engineering from Yokohama National University in 1998, 2000, 2003, respectively. From 2001 to 2003, he was a technical advisor at PI R&D Corporation in Yokohama. After that, he worked at Venture Business Laboratory of Tohoku University as a postdoctoral fellow for a year. From 2004 to 2009, he was an assistant professor at Department of Bioengineering and Robotics, Tohoku University. From 2010 to 2014, he was an associate professor at New Industry Creation Hatchery Center (NICHe), Tohoku University. From 2015-2016, he was an associate professor at Department of Bioengineering and Robotics, Tohoku University. He worked on many aspects of 3D and heterogeneous system integration including TSV (through-silicon via) technologies, capillary self-assembly, retinal prosthesis, and brain implantable probes in Tohoku University. From 2013, he also joined a consortium of 8/12-inch R&D fab, called Global INTegration Initiative (GINTI), for new 2.5D/3D integration technologies, Tohoku University. He is currently working on 3D/heterogeneous integration technologies at Department of Mechanical System Engineering, Tohoku University, as an associate professor, and new flexible device integration at Center for Heterogeneous Integration and Performance Scaling (CHIPS), Electrical Engineering Department, UCLA, as a visiting faculty. He was awarded “German Innovation Award / the Gottfried Wagener Prize 2009” and “2010 Outstanding Paper Award of the 60th Electronic Components and Technology Conference (ECTC)”, and so on.